이미지 |
부품 번호 |
제조업체 |
설명 |
패키지 |
재고 |
수량 |
Channel Type | Number of Drivers | Gate Type | Voltage - Supply | Logic Voltage - VIL, VIH | Current - Peak Output (Source, Sink) | Input Type | High Side Voltage - Max (Bootstrap) | Rise / Fall Time (Typ) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
4.5A MATCHED, HIGH -SPEED, LOW-S
|
패키지: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
재고5,520 |
|
Single | 2 | IGBT | 4.5 V ~ 18 V | 0.8V, 2V | 4.5A, 4.5A | Inverting | - | 12ns, 12ns | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Microchip Technology |
4.5A MATCHED, HIGH -SPEED, LOW-S
|
패키지: 8-WFDFN Exposed Pad |
재고22,680 |
|
Single | 2 | IGBT | 4.5 V ~ 18 V | 0.8V, 2V | 4.5A, 4.5A | Non-Inverting | - | 12ns, 12ns | -40°C ~ 125°C (TA) | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) |
||
Microchip Technology |
4.5A MATCHED, HIGH -SPEED, LOW-S
|
패키지: 8-WFDFN Exposed Pad |
재고16,932 |
|
Single | 2 | IGBT | 4.5 V ~ 18 V | 0.8V, 2V | 4.5A, 4.5A | Inverting | - | 12ns, 12ns | -40°C ~ 125°C (TA) | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) |
||
Microchip Technology |
4.5A MATCHED, HIGH -SPEED, LOW-S
|
패키지: 8-SOIC (0.154", 3.90mm Width) |
재고20,244 |
|
Single | 2 | IGBT | 4.5 V ~ 18 V | 0.8V, 2V | 4.5A, 4.5A | Inverting, Non-Inverting | - | 12ns, 12ns | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
4.5A MATCHED, HIGH -SPEED, LOW-S
|
패키지: 8-SOIC (0.154", 3.90mm Width) |
재고18,996 |
|
Single | 2 | IGBT | 4.5 V ~ 18 V | 0.8V, 2V | 4.5A, 4.5A | Non-Inverting | - | 12ns, 12ns | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
4.5A MATCHED, HIGH -SPEED, LOW-S
|
패키지: 8-SOIC (0.154", 3.90mm Width) |
재고14,580 |
|
Single | 2 | IGBT | 4.5 V ~ 18 V | 0.8V, 2V | 4.5A, 4.5A | Inverting | - | 12ns, 12ns | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
4.5A MATCHED, HIGH -SPEED, LOW-S
|
패키지: 8-WFDFN Exposed Pad |
재고6,928 |
|
Single | 2 | IGBT | 4.5 V ~ 18 V | 0.8V, 2V | 4.5A, 4.5A | Inverting, Non-Inverting | - | 12ns, 12ns | -40°C ~ 125°C (TA) | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) |
||
Microchip Technology |
4.5A MATCHED, HIGH -SPEED, LOW-S
|
패키지: 8-SOIC (0.154", 3.90mm Width) |
재고3,504 |
|
Single | 2 | IGBT | 4.5 V ~ 18 V | 0.8V, 2V | 4.5A, 4.5A | Non-Inverting | - | 12ns, 12ns | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
4.5A MATCHED, HIGH -SPEED, LOW-S
|
패키지: 8-SOIC (0.154", 3.90mm Width) |
재고2,800 |
|
Single | 2 | IGBT | 4.5 V ~ 18 V | 0.8V, 2V | 4.5A, 4.5A | Inverting | - | 12ns, 12ns | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
4.5A MATCHED, HIGH -SPEED, LOW-S
|
패키지: 8-SOIC (0.154", 3.90mm Width) |
재고4,496 |
|
Single | 2 | IGBT | 4.5 V ~ 18 V | 0.8V, 2V | 4.5A, 4.5A | Inverting, Non-Inverting | - | 12ns, 12ns | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
3.0A MATCHED, HIGH -SPEED, LOW-S
|
패키지: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
재고6,896 |
|
Independent | 2 | IGBT | 4.5 V ~ 18 V | 0.8V, 2V | 3A, 3A | Non-Inverting | - | 12ns, 12ns | -40°C ~ 125°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Microchip Technology |
3.0A MATCHED, HIGH -SPEED, LOW-S
|
패키지: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
재고7,840 |
|
Independent | 2 | IGBT | 4.5 V ~ 18 V | 0.8V, 2V | 3A, 3A | Inverting, Non-Inverting | - | 12ns, 12ns | -40°C ~ 125°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Microchip Technology |
3.0A MATCHED, HIGH -SPEED, LOW-S
|
패키지: 8-SOIC (0.154", 3.90mm Width) |
재고5,200 |
|
Independent | 2 | IGBT | 4.5 V ~ 18 V | 0.8V, 2V | 3A, 3A | Inverting | - | 12ns, 12ns | -40°C ~ 125°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
4.5A MATCHED, HIGH -SPEED, LOW-S
|
패키지: 8-WFDFN Exposed Pad |
재고29,574 |
|
Single | 2 | IGBT | 4.5 V ~ 18 V | 0.8V, 2V | 4.5A, 4.5A | Non-Inverting | - | 12ns, 12ns | -40°C ~ 125°C (TA) | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) |
||
Microchip Technology |
4.5A MATCHED, HIGH -SPEED, LOW-S
|
패키지: 8-WFDFN Exposed Pad |
재고27,234 |
|
Single | 2 | IGBT | 4.5 V ~ 18 V | 0.8V, 2V | 4.5A, 4.5A | Inverting | - | 12ns, 12ns | -40°C ~ 125°C (TA) | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) |
||
Microchip Technology |
3.0A MATCHED, HIGH -SPEED, LOW-S
|
패키지: 8-WFDFN Exposed Pad |
재고15,816 |
|
Independent | 2 | IGBT | 4.5 V ~ 18 V | 0.8V, 2V | 3A, 3A | Inverting, Non-Inverting | - | 12ns, 12ns | -40°C ~ 125°C | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) |
||
Microchip Technology |
3.0A MATCHED, HIGH -SPEED, LOW-S
|
패키지: 8-WFDFN Exposed Pad |
재고14,952 |
|
Independent | 2 | IGBT | 4.5 V ~ 18 V | 0.8V, 2V | 3A, 3A | Non-Inverting | - | 12ns, 12ns | -40°C ~ 125°C | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) |
||
Microchip Technology |
3.0A MATCHED, HIGH -SPEED, LOW-S
|
패키지: 8-WFDFN Exposed Pad |
재고14,520 |
|
Independent | 2 | IGBT | 4.5 V ~ 18 V | 0.8V, 2V | 3A, 3A | Inverting | - | 12ns, 12ns | -40°C ~ 125°C | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) |
||
Microchip Technology |
LOW-SIDE MOSFET DRIVER
|
패키지: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
재고19,632 |
|
Single | 2 | IGBT | 4.5 V ~ 18 V | 0.8V, 2V | 4.5A, 4.5A | Inverting, Non-Inverting | - | 12ns, 12ns | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Microchip Technology |
LOW-SIDE MOSFET DRIVER
|
패키지: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
재고19,722 |
|
Single | 2 | IGBT | 4.5 V ~ 18 V | 0.8V, 2V | 4.5A, 4.5A | Non-Inverting | - | 12ns, 12ns | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Microchip Technology |
LOW-SIDE MOSFET DRIVER
|
패키지: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
재고23,826 |
|
Single | 2 | IGBT | 4.5 V ~ 18 V | 0.8V, 2V | 4.5A, 4.5A | Inverting | - | 12ns, 12ns | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Microchip Technology |
3.0A MATCHED, HIGH -SPEED, LOW-S
|
패키지: 8-SOIC (0.154", 3.90mm Width) |
재고15,810 |
|
Independent | 2 | IGBT | 4.5 V ~ 18 V | 0.8V, 2V | 3A, 3A | Inverting, Non-Inverting | - | 12ns, 12ns | -40°C ~ 125°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
3.0A MATCHED, HIGH -SPEED, LOW-S
|
패키지: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
재고14,496 |
|
Independent | 2 | IGBT | 4.5 V ~ 18 V | 0.8V, 2V | 3A, 3A | Inverting, Non-Inverting | - | 12ns, 12ns | -40°C ~ 125°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Microchip Technology |
3.0A MATCHED, HIGH -SPEED, LOW-S
|
패키지: 8-SOIC (0.154", 3.90mm Width) |
재고22,332 |
|
Independent | 2 | IGBT | 4.5 V ~ 18 V | 0.8V, 2V | 3A, 3A | Non-Inverting | - | 12ns, 12ns | -40°C ~ 125°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
3.0A MATCHED, HIGH -SPEED, LOW-S
|
패키지: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
재고13,710 |
|
Independent | 2 | IGBT | 4.5 V ~ 18 V | 0.8V, 2V | 3A, 3A | Non-Inverting | - | 12ns, 12ns | -40°C ~ 125°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Microchip Technology |
3.0A MATCHED, HIGH -SPEED, LOW-S
|
패키지: 8-SOIC (0.154", 3.90mm Width) |
재고12,126 |
|
Independent | 2 | IGBT | 4.5 V ~ 18 V | 0.8V, 2V | 3A, 3A | Inverting | - | 12ns, 12ns | -40°C ~ 125°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
3.0A MATCHED, HIGH -SPEED, LOW-S
|
패키지: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
재고13,866 |
|
Independent | 2 | IGBT | 4.5 V ~ 18 V | 0.8V, 2V | 3A, 3A | Inverting | - | 12ns, 12ns | -40°C ~ 125°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Microchip Technology |
3.0A MATCHED, HIGH -SPEED, LOW-S
|
패키지: 8-WFDFN Exposed Pad |
재고25,920 |
|
Independent | 2 | IGBT | 4.5 V ~ 18 V | 0.8V, 2V | 3A, 3A | Inverting, Non-Inverting | - | 12ns, 12ns | -40°C ~ 125°C | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) |
||
Microchip Technology |
3.0A MATCHED, HIGH -SPEED, LOW-S
|
패키지: 8-WFDFN Exposed Pad |
재고29,658 |
|
Independent | 2 | IGBT | 4.5 V ~ 18 V | 0.8V, 2V | 3A, 3A | Non-Inverting | - | 12ns, 12ns | -40°C ~ 125°C | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) |
||
Microchip Technology |
3.0A MATCHED, HIGH -SPEED, LOW-S
|
패키지: 8-WFDFN Exposed Pad |
재고30,570 |
|
Independent | 2 | IGBT | 4.5 V ~ 18 V | 0.8V, 2V | 3A, 3A | Inverting | - | 12ns, 12ns | -40°C ~ 125°C | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) |