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New advanced chip packaging technology: Rectangular wafers instead of round ones

에 게시 6월 21, 2024
On June 20, IT Home quoted Nikkei Asia as saying that TSMC is studying a new advanced chip packaging method that uses rectangular substrates instead of traditional round wafers to place more chips on each wafer.

ASML announces Hyper NA EUV lithography machine: advancing to 0.2nm

에 게시 6월 21, 2024
ASML delivered the world's first High NA EUV extreme ultraviolet lithography machine to Intel at the end of last year. At the same time, it is researching a more powerful Hyper NA EUV lithography machine, which is expected to advance the semiconductor process to about 0.2nm, or 2 angstroms. The aperture value of ASML's first-generation Low NA EUV lithography machine is only 0.33, and the corresponding product is named NXE series, including the existing 3400B/C, 3600D, 3800E, and the future 4000F, 4200G, and 4X00.

Samsung Electronics to Launch HBM's 3D Packaging Technology SAINT-D This Year

에 게시 6월 19, 2024
On June 18, according to the Korea Economic Daily, Samsung Electronics will launch SAINT-D technology within this year, which can integrate HBM memory with processor chips in 3D. SAINT-D is a 3DIC advanced packaging technology of Samsung Electronics, which aims to vertically integrate logic die and DRAM memory die. The specific implementation of this technology is reported to be establishing a silicon interposer between the processor and the HBM chip.

Zuolan Microelectronics releases TC-SAW duplexer Band20/26

에 게시 6월 15, 2024
Recently, based on TC-SAW technology, Zuolan Microelectronics released high-performance, small-size Band26 and Band20 duplexers. The package size of the TC-SAW high-performance Band26/20 duplexer released this time is 1.6mm × 1.2mm, which is about 24% smaller than the 1814 package size, which can effectively reduce the board area. Its small size is more suitable for terminal customers who are becoming increasingly miniaturized in the 5G era, and provides more flexible solutions for application providers of various wireless communication systems.

ROHM Has Developed The World's Smallest CMOS Operational Amplifier for Smartphones and Small IoT Devices

에 게시 6월 13, 2024
ROHM, a world-renowned semiconductor manufacturer (headquartered in Kyoto, Japan), has developed a CMOS operational amplifier "TLR377GYZ" with an ultra-small package, which is ideal for amplifying sensor detection signals such as temperature, pressure, and flow in applications such as smartphones and small IoT devices.

Japan Proposes Legislation to Provide Substantial Funding for 2-nanometer Chips

에 게시 6월 7, 2024
On June 5, according to Nikkei News today, the draft of the basic policy for economic and fiscal operations and reforms that the Japanese government will finalize in late June has now been made public. In order to promote the mass production of next-generation semiconductors, the local government has included a policy to improve relevant laws. The draft mentioned that in order to achieve mass production of next-generation semiconductors, "Necessary and Legal" measures will be studied.

South Korea's Semiconductor Exports in May Reached US$11.38 billion

에 게시 6월 6, 2024
According to reports, since the resumption of growth in November of last year, ending the 15-month year-on-year decline, South Korea's monthly semiconductor exports have continued to grow year-on-year, including in May.

When memory chips coincide with the development of smart cars

에 게시 5월 8, 2023
Where there is data, there is storage. As we all know, semiconductor memory has the characteristics of small size and fast storage speed, which can be widely used in server, PC, smart phone, automobile, Internet of things, mobile storage and other fields.

Component sales sentiment declined in March, and delivery time continued to shorten

에 게시 4월 26, 2023
According to ECIA's latest Electronic Components Sales Trend (ECST) survey, the electronic components Sales Trend index surged in February, but cooled in March. In the February survey, respondents had expected sales sentiment to improve in March. However, the actual result in March was a 2-point drop in overall sentiment to 88.6

Semiconductor investment slowed down, equipment engineering plant operation growth is feared to stall

에 게시 4월 20, 2023
With the continuous development of global economy, semiconductor industry has become one of the key points of economic competition. However, in recent years, the investment in the semiconductor industry has slowed down, and the operation of equipment engineering plants is feared to be stagnant, which has aroused people's concern. This article will analyze the reasons for the slowdown in semiconductor industry investment from a variety of perspectives, and explore the possible challenges facing the operation of equipment engineering plants.