이미지 |
부품 번호 |
제조업체 |
설명 |
패키지 |
재고 |
수량 |
Number of Elements | Output Type | Voltage - Supply, Single/Dual (±) | Voltage - Input Offset (Max) | Current - Input Bias (Max) | Current - Output (Typ) | Current - Quiescent (Max) | CMRR, PSRR (Typ) | Propagation Delay (Max) | Hysteresis | Operating Temperature | Package / Case | Mounting Type | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC COMPARATOR MICROPWR 4MLF
|
패키지: 4-UFDFN Exposed Pad |
재고4,688 |
|
1 | Open Drain | 1.5 V ~ 5.5 V | - | - | 20mA | 3µA | - | 12µs | 20mV | -40°C ~ 85°C | 4-UFDFN Exposed Pad | Surface Mount | 4-TDFN (1.2x1.6) |
||
Microchip Technology |
IC COMPARATOR MICROPWR 4MLF
|
패키지: 4-UFDFN Exposed Pad |
재고3,184 |
|
1 | Push-Pull | 1.5 V ~ 5.5 V | - | - | 20mA | 3µA | - | 12µs | 20mV | -40°C ~ 85°C | 4-UFDFN Exposed Pad | Surface Mount | 4-TDFN (1.2x1.6) |
||
Microchip Technology |
IC COMPARATOR MICROPWR 6MLF
|
패키지: 4-UFDFN Exposed Pad |
재고2,784 |
|
1 | Push-Pull | 1.5 V ~ 5.5 V | - | - | 20mA | 3µA | - | 12µs | 20mV | -40°C ~ 85°C | 4-UFDFN Exposed Pad | Surface Mount | 4-TDFN (1.2x1.6) |
||
Microchip Technology |
IC COMPARATOR MICROPWR 4TDFN
|
패키지: 4-UFDFN Exposed Pad |
재고4,624 |
|
1 | Open Drain | 1.5 V ~ 5.5 V | - | - | 20mA | 3µA | - | 12µs | 20mV | -40°C ~ 85°C | 4-UFDFN Exposed Pad | Surface Mount | 4-TDFN (1.2x1.6) |
||
Microchip Technology |
IC COMPARATOR MICROPWR 4TDFN
|
패키지: 4-UFDFN Exposed Pad |
재고6,272 |
|
1 | Push-Pull | 1.5 V ~ 5.5 V | - | - | 20mA | 3µA | - | 12µs | 20mV | -40°C ~ 85°C | 4-UFDFN Exposed Pad | Surface Mount | 4-TDFN (1.2x1.6) |
||
Microchip Technology |
IC COMPARATOR MICROPWR 4TDFN
|
패키지: 4-UFDFN Exposed Pad |
재고5,184 |
|
1 | Push-Pull | 1.5 V ~ 5.5 V | - | - | 20mA | 3µA | - | 12µs | 20mV | -40°C ~ 85°C | 4-UFDFN Exposed Pad | Surface Mount | 4-TDFN (1.2x1.6) |
||
Microchip Technology |
IC COMP OPENDRN 1.6V SNGL 8-MSOP
|
패키지: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
재고6,228 |
|
1 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | Surface Mount | 8-MSOP |
||
Microchip Technology |
IC COMP 1.6V SNGL O-D W/CS 8DIP
|
패키지: 8-DIP (0.300", 7.62mm) |
재고7,392 |
|
1 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 8-DIP (0.300", 7.62mm) | Through Hole | 8-PDIP |
||
Microchip Technology |
IC COMPARATOR MICROPWR 6MLF
|
패키지: 6-UFDFN Exposed Pad |
재고7,984 |
|
1 | Open Drain | 1.5 V ~ 5.5 V | - | - | 20mA | 3µA | - | 12µs | 20mV | -40°C ~ 85°C | 6-UFDFN Exposed Pad | Surface Mount | 6-TDFN (1.6x1.6) |
||
Microchip Technology |
IC COMPARATOR MICROPWR 6MLF
|
패키지: 6-UFDFN Exposed Pad |
재고6,704 |
|
1 | Push-Pull | 1.5 V ~ 5.5 V | - | - | 20mA | 3µA | - | 12µs | 20mV | -40°C ~ 85°C | 6-UFDFN Exposed Pad | Surface Mount | 6-TDFN (1.6x1.6) |
||
Microchip Technology |
IC COMPARATOR MICROPWR 6MLF
|
패키지: 6-UFDFN Exposed Pad |
재고2,096 |
|
1 | Push-Pull | 1.5 V ~ 5.5 V | - | - | 20mA | 3µA | - | 12µs | 20mV | -40°C ~ 85°C | 6-UFDFN Exposed Pad | Surface Mount | 6-TDFN (1.6x1.6) |
||
Microchip Technology |
IC COMPARATOR MICROPWR 6TDFN
|
패키지: 6-UFDFN Exposed Pad |
재고3,920 |
|
1 | Open Drain | 1.5 V ~ 5.5 V | - | - | 20mA | 3µA | - | 12µs | 20mV | -40°C ~ 85°C | 6-UFDFN Exposed Pad | Surface Mount | 6-TDFN (1.6x1.6) |
||
Microchip Technology |
IC COMP 1.6V SNGL O-D 8MSOP
|
패키지: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
재고4,512 |
|
1 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | Surface Mount | 8-MSOP |
||
Microchip Technology |
IC COMP OPENDRN 1.6V SNGL 8-MSOP
|
패키지: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
재고7,504 |
|
1 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | Surface Mount | 8-MSOP |
||
Microchip Technology |
IC COMP 1.6V DUAL P-P 8MSOP
|
패키지: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
재고3,920 |
|
2 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | Surface Mount | 8-MSOP |
||
Microchip Technology |
IC COMP 1.6V DUAL O-D 8SOIC
|
패키지: 8-SOIC (0.154", 3.90mm Width) |
재고4,944 |
|
2 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 8-SOIC (0.154", 3.90mm Width) | Surface Mount | 8-SOIC |
||
Microchip Technology |
IC COMP 1.6V DUAL P-P 8SOIC
|
패키지: 8-SOIC (0.154", 3.90mm Width) |
재고2,272 |
|
2 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 8-SOIC (0.154", 3.90mm Width) | Surface Mount | 8-SOIC |
||
Microchip Technology |
IC COMP 1.6V DUAL O-D 8DIP
|
패키지: 8-DIP (0.300", 7.62mm) |
재고2,320 |
|
2 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 8-DIP (0.300", 7.62mm) | Through Hole | 8-PDIP |
||
Microchip Technology |
IC COMP OPENDRN 1.6V DUAL 8-SOIC
|
패키지: 8-SOIC (0.154", 3.90mm Width) |
재고29,580 |
|
2 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | Surface Mount | 8-SOIC |
||
Microchip Technology |
IC COMP OPENDRN 1.6V DUAL 8-MSOP
|
패키지: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
재고200,328 |
|
2 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | Surface Mount | 8-MSOP |
||
Microchip Technology |
IC COMP PUSHPULL 1.6V DUAL 8-DIP
|
패키지: 8-DIP (0.300", 7.62mm) |
재고17,436 |
|
2 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | Through Hole | 8-PDIP |
||
Microchip Technology |
IC COMP OPENDRN 1.6V DUAL 8-DIP
|
패키지: 8-DIP (0.300", 7.62mm) |
재고3,136 |
|
2 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | Through Hole | 8-PDIP |
||
Microchip Technology |
IC COMP PUSHPULL 1.6V DUAL 8MSOP
|
패키지: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
재고32,904 |
|
2 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | Surface Mount | 8-MSOP |
||
Microchip Technology |
IC COMP OPENDRN 1.6V DUAL 8-MSOP
|
패키지: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
재고235,908 |
|
2 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | Surface Mount | 8-MSOP |
||
Microchip Technology |
IC COMP SNGL W/REF SC70-5
|
패키지: 5-TSSOP, SC-70-5, SOT-353 |
재고6,192 |
|
1 | Open Drain | 1.5 V ~ 5.5 V | - | - | 20mA | 3µA | - | 12µs | 20mV | -40°C ~ 85°C | 5-TSSOP, SC-70-5, SOT-353 | Surface Mount | SC-70-5 |
||
Microchip Technology |
IC COMP 1.6V SGL P-P W/CS 8-SOIC
|
패키지: 8-SOIC (0.154", 3.90mm Width) |
재고2,496 |
|
1 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 8-SOIC (0.154", 3.90mm Width) | Surface Mount | 8-SOIC |
||
Microchip Technology |
IC COMP 1.6V SNGL P-P W/CS 8MSOP
|
패키지: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
재고2,384 |
|
1 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | Surface Mount | 8-MSOP |
||
Microchip Technology |
IC COMP 1.6V SNGL P-P W/CS 8MSOP
|
패키지: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
재고19,188 |
|
1 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | Surface Mount | 8-MSOP |
||
Microchip Technology |
IC COMP 1.6V SNGL O-D W/CS 8MSOP
|
패키지: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
재고6,944 |
|
1 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | Surface Mount | 8-MSOP |
||
Microchip Technology |
IC COMP 1.6V SGL O-D W/CS 8MSOP
|
패키지: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
재고5,072 |
|
1 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | Surface Mount | 8-MSOP |