이미지 |
부품 번호 |
제조업체 |
설명 |
패키지 |
재고 |
수량 |
Protocol | Number of Drivers/Receivers | Duplex | Receiver Hysteresis | Data Rate | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC TXRX LIN 3.3V LDO 14-TSSOP
|
패키지: 14-TSSOP (0.173", 4.40mm Width) |
재고4,624 |
|
LIN | 1/1 | Half | 175mV | - | 6 V ~ 18 V | -40°C ~ 125°C | Surface Mount | 14-TSSOP (0.173", 4.40mm Width) | 14-TSSOP |
||
Microchip Technology |
IC TXRX LIN 5.0V LDO 14-TSSOP
|
패키지: 14-TSSOP (0.173", 4.40mm Width) |
재고6,336 |
|
LIN | 1/1 | Half | 175mV | - | 6 V ~ 18 V | -40°C ~ 125°C | Surface Mount | 14-TSSOP (0.173", 4.40mm Width) | 14-TSSOP |
||
Microchip Technology |
IC TXRX ETHERNET 100MBPS 48LQFP
|
패키지: 48-LQFP |
재고5,328 |
|
Ethernet | 1/1 | Full | - | 100Mbps | 3.3V | 0°C ~ 70°C | Surface Mount | 48-LQFP | 48-LQFP (7x7) |
||
Microchip Technology |
IC TXRX USB FLEXPWR 24QFN
|
패키지: 24-VFQFN Exposed Pad |
재고6,016 |
|
USB 2.0 | - | - | - | - | 1.6 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN-EP (4x4) |
||
Microchip Technology |
IC TRANSCEIVER CAN FLEX 8DFN
|
패키지: 8-VDFN Exposed Pad |
재고4,880 |
|
CAN | 1/1 | - | 200mV | 8Mbps | 4.5 V ~ 5.5 V | -40°C ~ 150°C | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (3x3) |
||
Microchip Technology |
IC LIN BUS BIDIRECT 8DFN
|
패키지: 8-VDFN Exposed Pad |
재고8,148 |
|
LIN | 1/1 | Half | 175mV | - | 6 V ~ 27 V | -40°C ~ 125°C | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (4x4) |
||
Microchip Technology |
IC TXRX CAN VIO 8DFN
|
패키지: 8-VDFN Exposed Pad |
재고7,344 |
|
CAN | 1/1 | - | 120mV | - | 4.5 V ~ 5.5 V | -40°C ~ 150°C | Surface Mount | 8-VDFN Exposed Pad | 8-VDFN (3x3) |
||
Microchip Technology |
IC TXRX USB 2.0 32QFN
|
패키지: 32-VFQFN Exposed Pad |
재고13,200 |
|
USB 2.0 | 1/1 | - | 150mV | - | - | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN |
||
Microchip Technology |
IC TXRX ETHERNET 32QFN
|
패키지: 32-VFQFN Exposed Pad |
재고13,224 |
|
MII, RMII | 4/4 | Full | - | - | 1.6 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-SQFN (5x5) |
||
Microchip Technology |
IC TXRX LIN 5V 50MA 8SOIC
|
패키지: 8-SOIC (0.154", 3.90mm Width) |
재고216,708 |
|
LIN | 1/1 | Half | 175mV | - | 6 V ~ 18 V | -40°C ~ 125°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC TXRX ETHERNET 32QFN
|
패키지: 32-VFQFN Exposed Pad |
재고19,812 |
|
MII, RMII | 4/4 | Full | - | - | 1.6 V ~ 3.6 V | 0°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-SQFN (5x5) |
||
Microchip Technology |
IC TXRX ETHERNET 24QFN
|
패키지: 24-VFQFN Exposed Pad |
재고17,388 |
|
RMII | 2/2 | Full | - | - | 1.6 V ~ 3.6 V | 0°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-SQFN (4x4) |
||
Microchip Technology |
CAN FD TRANSCEIVER
|
패키지: 8-SOIC (0.154", 3.90mm Width) |
재고7,704 |
|
CAN | 1/1 | - | 200mV | 8Mbps | 4.5 V ~ 5.5 V | -40°C ~ 150°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC TXRX CAN FD 8MBPS 8SOIC
|
패키지: 8-SOIC (0.154", 3.90mm Width) |
재고10,008 |
|
CAN | 1/1 | - | 200mV | - | 4.5 V ~ 5.5 V | -40°C ~ 150°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
CAN FD TRANSCEIVER
|
패키지: 8-SOIC (0.154", 3.90mm Width) |
재고16,260 |
|
CAN | 1/1 | - | 200mV | 8Mbps | 4.5 V ~ 5.5 V | -40°C ~ 150°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
CAN FD TRANSCEIVER
|
패키지: 8-SOIC (0.154", 3.90mm Width) |
재고15,528 |
|
CAN | 1/1 | - | 200mV | 8Mbps | 4.5 V ~ 5.5 V | -40°C ~ 150°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
CAN FD TRANSCEIVER
|
패키지: 8-SOIC (0.154", 3.90mm Width) |
재고16,368 |
|
CAN | 1/1 | - | 200mV | 8Mbps | 4.5 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC DRVR COAX CABLE 3.3V/5V 8MSOP
|
패키지: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
재고954,600 |
|
- | 2/0 | - | - | - | 3.3V, 5V | - | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Microchip Technology |
IC TXRX LIN 3.3V 70MA 8DFN
|
패키지: 8-VDFN Exposed Pad |
재고6,320 |
|
LIN | 1/1 | Half | 175mV | - | 6 V ~ 18 V | -40°C ~ 125°C | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (4x4) |
||
Microchip Technology |
IC TXRX LIN 8DFN
|
패키지: 8-VDFN Exposed Pad |
재고9,600 |
|
LIN | 1/1 | Half | 175mV | - | 6 V ~ 27 V | -40°C ~ 125°C | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (4x4) |
||
Microchip Technology |
IC TXRX LIN 3.3V LDO 8-DFN
|
패키지: 8-VDFN Exposed Pad |
재고8,724 |
|
LIN | 1/1 | Half | 175mV | - | 6 V ~ 18 V | -40°C ~ 125°C | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (4x4) |
||
Microchip Technology |
IC TXRX ETHERNET 32QFN
|
패키지: 32-VFQFN Exposed Pad |
재고8,616 |
|
Ethernet | 1/1 | - | - | - | 1.6 V ~ 3.6 V | 0°C ~ 70°C | Surface Mount | 32-VFQFN Exposed Pad | 32-SQFN (5x5) |
||
Microchip Technology |
IC TXRX LIN 5V 70MA 8SOIC
|
패키지: 8-SOIC (0.154", 3.90mm Width) |
재고8,688 |
|
LIN | 1/1 | Half | 175mV | - | 6 V ~ 18 V | -40°C ~ 125°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC TRANSCEIVER CAN HI-SPD 14SOIC
|
패키지: 14-SOIC (0.154", 3.90mm Width) |
재고6,576 |
|
CAN | 2/2 | - | 200mV | 8Mbps | 4.5 V ~ 5.5 V | -40°C ~ 150°C | Surface Mount | 14-SOIC (0.154", 3.90mm Width) | 14-SOIC |
||
Microchip Technology |
IC TRANSCEIVER CAN FLEX 8SOIC
|
패키지: 8-SOIC (0.154", 3.90mm Width) |
재고9,372 |
|
CAN | 1/1 | - | 200mV | 8Mbps | 4.5 V ~ 5.5 V | -40°C ~ 150°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC TXRX CAN HS W/SPLIT 8DIP
|
패키지: 8-DIP (0.300", 7.62mm) |
재고6,276 |
|
CAN | 1/1 | - | 200mV | 8Mbps | 4.5 V ~ 5.5 V | -40°C ~ 125°C | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC LIN BUS BIDIRECT 8DIP
|
패키지: 8-DIP (0.300", 7.62mm) |
재고16,056 |
|
LIN | 1/1 | Half | 175mV | - | 6 V ~ 27 V | -40°C ~ 125°C | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC TXRX LIN 3.3V 70MA 8DIP
|
패키지: 8-DIP (0.300", 7.62mm) |
재고9,636 |
|
LIN | 1/1 | Half | 175mV | - | 6 V ~ 18 V | -40°C ~ 125°C | Through Hole | 8-DIP (0.300", 7.62mm) | 8-DIP |
||
Microchip Technology |
IC TXRX ETHERNET 32QFN
|
패키지: 32-VFQFN Exposed Pad |
재고41,352 |
|
MII, RMII | 4/4 | Full | - | - | 1.6 V ~ 3.6 V | 0°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN Exposed Pad (5x5) |
||
Microchip Technology |
IC TXRX LIN 3.3V LDO 8-SOIC
|
패키지: 8-SOIC (0.154", 3.90mm Width) |
재고565,200 |
|
LIN | 1/1 | Half | 175mV | - | 6 V ~ 18 V | -40°C ~ 125°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |