이미지 |
부품 번호 |
제조업체 |
설명 |
패키지 |
재고 |
수량 |
Number of Cores/Bus Width | Speed | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Operating Temperature | Security Features | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
IC MPU Q OR IQ 1.0GHZ 425TEBGA
|
패키지: 425-FBGA |
재고7,360 |
|
1 Core, 32-Bit | 1.0GHz | - | DDR3, DDR3L | No | - | 10/100/1000 Mbps (3) | SATA 3Gbps (2) | USB 2.0 + PHY (1) | - | -40°C ~ 105°C (TA) | - | 425-FBGA | 425-TEPBGA I (19x19) |
||
NXP |
IC MPU Q OR IQ 2.0GHZ 1295FCBGA
|
패키지: 1295-BBGA, FCBGA |
재고4,112 |
|
2 Core, 64-Bit | 2.0GHz | - | DDR3, DDR3L | No | - | 1 Gbps (5), 10 Gbps (1) | SATA 3Gbps (2) | USB 2.0 + PHY (2) | - | 0°C ~ 105°C (TA) | - | 1295-BBGA, FCBGA | 1295-FCPBGA (37.5x37.5) |
||
NXP |
IC MPU MPC85XX 1.0GHZ 783FCBGA
|
패키지: 783-BBGA, FCBGA |
재고5,904 |
|
1 Core, 32-Bit | 1.0GHz | - | DDR, DDR2 | No | - | 10/100/1000 Mbps (2) | - | - | 1.8V, 2.5V, 3.3V | 0°C ~ 90°C (TA) | - | 783-BBGA, FCBGA | 783-FCPBGA (29x29) |
||
NXP |
IC MPU MPC85XX 1.0GHZ 783FCBGA
|
패키지: 784-BBGA, FCBGA |
재고5,184 |
|
1 Core, 32-Bit | 1.0GHz | - | DDR, SDRAM | No | - | 10/100 Mbps (1), 10/100/1000 Mbps (2) | - | - | 2.5V, 3.3V | 0°C ~ 105°C (TA) | - | 784-BBGA, FCBGA | 783-FCPBGA (29x29) |
||
NXP |
IC MPU MPC85XX 1.0GHZ 783FCBGA
|
패키지: 783-BBGA, FCBGA |
재고3,104 |
|
1 Core, 32-Bit | 1.0GHz | Security; SEC | DDR2, DDR3 | No | - | 10/100/1000 Mbps (2) | SATA 3Gbps (2) | USB 2.0 (3) | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | Cryptography | 783-BBGA, FCBGA | 783-FCPBGA (29x29) |
||
NXP |
IC MPU MPC85XX 1.0GHZ 783FCBGA
|
패키지: 783-BBGA, FCBGA |
재고5,856 |
|
1 Core, 32-Bit | 1.0GHz | - | DDR2, DDR3 | No | - | 10/100/1000 Mbps (2) | SATA 3Gbps (2) | USB 2.0 (3) | 1.8V, 2.5V, 3.3V | -40°C ~ 105°C (TA) | - | 783-BBGA, FCBGA | 783-FCPBGA (29x29) |
||
NXP |
IC MPU MPC85XX 1.0GHZ 783FCBGA
|
패키지: 783-BBGA, FCBGA |
재고3,360 |
|
1 Core, 32-Bit | 1.0GHz | Security; SEC | DDR2, DDR3 | No | - | 10/100/1000 Mbps (2) | SATA 3Gbps (1) | USB 2.0 (2) | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | Cryptography | 783-BBGA, FCBGA | 783-FCPBGA (29x29) |
||
NXP |
IC MPU MPC83XX 266MHZ 668BGA
|
패키지: 668-BBGA Exposed Pad |
재고3,792 |
|
1 Core, 32-Bit | 266MHz | Communications; QUICC Engine, Security; SEC | DDR, DDR2 | No | - | 10/100/1000 Mbps (1) | - | USB 1.x (1) | 1.8V, 2.5V, 3.3V | -40°C ~ 105°C (TA) | Cryptography, Random Number Generator | 668-BBGA Exposed Pad | 668-PBGA-PGE (29x29) |
||
NXP |
IC MPU MPC83XX 266MHZ 516BGA
|
패키지: 516-BBGA |
재고2,096 |
|
1 Core, 32-Bit | 266MHz | Communications; QUICC Engine, Security; SEC 2.2 | DDR, DDR2 | No | - | 10/100 Mbps (3) | - | USB 2.0 (1) | 1.8V, 2.5V, 3.3V | -40°C ~ 105°C (TA) | Cryptography | 516-BBGA | 516-FPBGA (27x27) |
||
NXP |
IC MPU MPC83XX 533MHZ 672TBGA
|
패키지: 672-LBGA |
재고2,480 |
|
1 Core, 32-Bit | 533MHz | Security; SEC | DDR, DDR2 | No | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (2) | 1.8V, 2.5V, 3.3V | -40°C ~ 105°C (TA) | Cryptography, Random Number Generator | 672-LBGA | 672-TBGA (35x35) |
||
NXP |
IC MPU MPC83XX 400MHZ 620BGA
|
패키지: 620-BBGA Exposed Pad |
재고3,968 |
|
1 Core, 32-Bit | 400MHz | Security; SEC | DDR, DDR2 | No | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | Cryptography, Random Number Generator | 620-BBGA Exposed Pad | 620-PBGA (29x29) |
||
NXP |
IC MPU MPC8XX 50MHZ 357BGA
|
패키지: 357-BBGA |
재고3,552 |
|
1 Core, 32-Bit | 50MHz | Communications; CPM | DRAM | No | - | 10 Mbps (4), 10/100 Mbps (1) | - | - | 3.3V | 0°C ~ 105°C (TA) | - | 357-BBGA | 357-PBGA (25x25) |
||
NXP |
IC MPU MPC8XX 66MHZ 357BGA
|
패키지: 357-BBGA |
재고5,040 |
|
1 Core, 32-Bit | 66MHz | Communications; CPM | DRAM | No | - | 10 Mbps (1), 10/100 Mbps (1) | - | - | 3.3V | 0°C ~ 105°C (TA) | - | 357-BBGA | 357-PBGA (25x25) |
||
NXP |
IC MPU MPC82XX 300MHZ 408TBGA
|
패키지: 480-LBGA |
재고4,064 |
|
1 Core, 32-Bit | 300MHz | Communications; RISC CPM | DRAM, SDRAM | No | - | 10/100 Mbps (3) | - | - | 3.3V | 0°C ~ 105°C (TA) | - | 480-LBGA | 408-TBGA (37.5x37.5) |
||
Microchip Technology |
IC MPU 603E 266MHZ 255CBGA
|
패키지: 255-CBBGA Exposed Pad |
재고2,272 |
|
1 Core, 32-Bit | 266MHz | - | - | No | - | - | - | - | 3.3V | -40°C ~ 110°C (TC) | - | 255-CBBGA Exposed Pad | 255-HiTCE-CBGA (21x21) |
||
NXP |
IC MPU MPC82XX 266MHZ 408TBGA
|
패키지: 480-LBGA |
재고6,944 |
|
1 Core, 32-Bit | 266MHz | Communications; RISC CPM | DRAM, SDRAM | No | - | 10/100 Mbps (3) | - | - | 3.3V | -40°C ~ 105°C (TA) | - | 480-LBGA | 408-TBGA (37.5x37.5) |
||
NXP |
IC MPU MPC85XX 1.5GHZ 1023FCBGA
|
패키지: 1023-BBGA, FCBGA |
재고2,992 |
|
2 Core, 32-Bit | 1.5GHz | Signal Processing; SPE | DDR2, DDR3 | No | - | 10/100/1000 Mbps (4) | - | - | 1.5V, 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | - | 1023-BBGA, FCBGA | 1023-FCPBGA (33x33) |
||
NXP |
IC MPU Q OR IQ 1.333GHZ 780FCBGA
|
패키지: 780-BFBGA, FCBGA |
재고4,448 |
|
2 Core, 32-Bit | 1.333GHz | Signal Processing; SC3850 - Dual | DDR3, DDR3L | No | - | 10/100/1000 Mbps (2) | - | USB 2.0 (1) | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | - | 780-BFBGA, FCBGA | 780-FCBGA (23x23) |
||
NXP |
IC MPU MPC8XX 80MHZ 357BGA
|
패키지: 357-BBGA |
재고5,312 |
|
1 Core, 32-Bit | 80MHz | Communications; CPM | DRAM | No | - | 10 Mbps (2) | - | - | 3.3V | 0°C ~ 95°C (TA) | - | 357-BBGA | 357-PBGA (25x25) |
||
NXP |
IC MPU MPC8XX 50MHZ 357BGA
|
패키지: 357-BBGA |
재고6,336 |
|
1 Core, 32-Bit | 50MHz | Communications; CPM | DRAM | No | - | 10 Mbps (2), 10/100 Mbps (1) | - | - | 3.3V | -40°C ~ 95°C (TA) | - | 357-BBGA | 357-PBGA (25x25) |
||
NXP |
IC MPU MPC52XX 400MHZ 272BGA
|
패키지: 272-BBGA |
재고25,284 |
|
1 Core, 32-Bit | 400MHz | - | DDR, SDRAM | No | - | 10/100 Mbps (1) | - | USB 1.1 (2) | 2.5V, 3.3V | -40°C ~ 85°C (TA) | - | 272-BBGA | 272-PBGA (27x27) |
||
Texas Instruments |
IC MPU CORTEX SITARA 423FCBGA
|
패키지: 1089-BFBGA, FCBGA |
재고6,816 |
|
1 Core, 32-Bit | 800MHz | Multimedia; NEON? SIMD | SDRAM | No | LCD | - | - | USB 2.0 (4) | 1.8V | 0°C ~ 90°C (TJ) | - | 1089-BFBGA, FCBGA | 1089-FCBGA (27x27) |
||
Zilog |
IC MPU Z180 20MHZ 68PLCC
|
패키지: 68-LCC (J-Lead) |
재고3,824 |
|
1 Core, 8-Bit | 20MHz | - | DRAM | No | - | - | - | - | 5.0V | -40°C ~ 100°C (TA) | - | 68-LCC (J-Lead) | 68-PLCC |
||
NXP |
IC MPU MPC8XX 100MHZ 357BGA
|
패키지: 357-BBGA |
재고3,984 |
|
1 Core, 32-Bit | 100MHz | Communications; CPM | DRAM | No | - | 10 Mbps (4), 10/100 Mbps (1) | - | - | 3.3V | -40°C ~ 100°C (TA) | - | 357-BBGA | 357-PBGA (25x25) |
||
Texas Instruments |
IC MPU SITARA 800MHZ 423FCBGA
|
패키지: 423-LFBGA, FCBGA |
재고20,952 |
|
1 Core, 32-Bit | 800MHz | Multimedia; NEON? SIMD | SDRAM | Yes | LCD | - | - | USB 2.0 (4) | 1.8V | 0°C ~ 90°C (TJ) | - | 423-LFBGA, FCBGA | 423-FCBGA (16x16) |
||
NXP |
EPDC, 2 ETH, CAN, 2 OTG 1 HSIC,
|
패키지: 488-TFBGA |
재고7,896 |
|
2 Core, 32-Bit | 1.0GHz | Multimedia; NEON? MPE | LPDDR2, LPDDR3, DDR3, DDR3L | No | Keypad, LCD, MIPI | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | 1.8V, 3.3V | 0°C ~ 95°C (TJ) | A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS | 488-TFBGA | 488-FBGA (12x12) |
||
NXP |
QORIQ 64B POWER 8X 1.5GHZ THRE
|
패키지: - |
재고6,288 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
NXP |
I.MX6D ROM PERF ENHAN
|
패키지: 624-FBGA, FCBGA |
재고4,944 |
|
2 Core, 32-Bit | 1.0GHz | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | -40°C ~ 125°C (TJ) | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | 624-FBGA, FCBGA | 624-FCBGA (21x21) |
||
NXP |
LS1 32BIT ARM SOC 1.2GHZ DDR3/
|
패키지: 525-FBGA, FCBGA |
재고7,216 |
|
2 Core, 32-Bit | 1.2GHz | Multimedia; NEON™ SIMD | DDR3L, DDR4 | No | - | GbE (3) | SATA 3Gbps (1) | USB 2.0 (1), USB 3.0 + PHY | - | 0°C ~ 105°C | - | 525-FBGA, FCBGA | 525-FCPBGA (19x19) |
||
Broadcom Limited |
DUAL CORE
|
패키지: - |
재고6,960 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |